Two cryostats · one photonic link · gates, not dates

Two modules.
One interconnect.
One logical qubit.

QONTOS-1 is the first-machine assembly of the QONTOS architecture. One thousand superconducting transmons across two cryostat-mounted modules are joined by a heralded electro-optic interconnect at 1,550 nm. Programme acceptance is gated by four engineering milestones: architecture freeze at G1, module acceptance at G2, Bell-pair validation at G3, and the first logical qubit at G4.

FIRST-MACHINE ASSEMBLY · GEN I v5.4 CONTROL RACK A AWG · FPGA · digitiser decoder · runtime host 295 K · room-temperature drive · flux · RO MODULE A · CRYOSTAT 295 K → ≤ 20 mK · 5 stages chiplet 01 · 100 chiplet 02 · 100 chiplet 03 · 100 chiplet 04 · 100 chiplet 05 · 100 500 transmons · heavy-hex PHOTONIC INTERCONNECT · 1.5 K 1,550 nm 50/50 BS + SNSPD pair MODULE B · CRYOSTAT 295 K → ≤ 20 mK · 5 stages chiplet 01 · 100 chiplet 02 · 100 chiplet 03 · 100 chiplet 04 · 100 chiplet 05 · 100 500 transmons · heavy-hex CONTROL RACK B AWG · FPGA · digitiser decoder · runtime host 295 K · room-temperature phase-locked to rack A FACILITY ~4 m × 6 m floor 2 cryostats + 2 racks SUMMARY PHYSICAL 1,000 LOGICAL 1 · d = 5 2Q ERROR 5 × 10⁻³ η · BASE ≥ 0.1 % CYCLE 1 μs GEN I · TWO-MODULE · HERALDED INTERCONNECT TARGET · G1 → G4

The first-machine programme retires architectural risk one acceptance gate at a time.

Programme overview

The rig that proves the architecture, not the rig that ships fault tolerance.

QONTOS-1 is not specified to deliver fault-tolerant computation. It is specified to retire, at a measurable subsystem gate, every architectural risk that stands between the present superconducting platform and a fault-tolerant successor: chiplet IO, control-density on the mixing chamber, microwave-to-optical transduction efficiency, decoder latency, and cross-module Bell-pair fidelity.

The runtime is operational against simulator and external-provider backends today. At G2, the same compiled plan switches over to QONTOS-1 hardware through a single ExecutorContract. Plan-time work is identical; only the executor changes.

DOWNLOAD WHITEPAPER · V5.4 ↗
Architecture at a glance

Five subsystems, four acceptance gates, one runtime.

The first-machine specification is a strict subset of the QONTOS family arc. Every subsystem that ships in QONTOS-1 either becomes a building block of QONTOS-2 or sets the engineering constraint that the successor generation is sized to outperform. Five subsystems carry the assembly; four engineering gates measure it; one runtime addresses every backend the programme can target.

Two-module compute envelope

Two independent dilution refrigerators, five tantalum-on-silicon transmon chiplets per module, heavy-hex intra-chiplet topology with tunable-coupler CZ gates.

Heralded electro-optic interconnect

Microwave-to-1,550 nm transduction through a LiNbO₃ resonator at the 100 mK still plate. Cooperativity C = 1 sets the impedance-matched conversion point.

Microsecond decoder loop

FPGA sequencer closes the stabilizer round in 1 μs; the MWPM decoder farm matches the syndrome in 5 μs; feed-forward correction emerges within 10 μs total.

Provider-agnostic runtime

The QONTOS runtime addresses simulator, IBM Quantum, Amazon Braket, and the native QONTOS-1 executor through a single ExecutorContract. Compile once, route anywhere.

Three-layer SHA-256 proof

Every run emits a cryptographic proof chain binding circuit, plan, and result. The artefact replays the run end to end; tampering at any stage invalidates it.

The QONTOS family arc

QONTOS-1 is generation one of five.

Each generation is sized against the engineering risk retired by the one before it. QONTOS-1 specifies two modules and one logical qubit; QONTOS-2 quadruples the module count; QONTOS-3 carries the architecture into the commercial fault-tolerant regime. Targets are engineering objectives gated by subsystem milestones, not measured performance.

Modules
2
two cryostats, one link
Physical qubits
1,000
5 chiplets × 100 / module
Logical qubits
1
distance-d surface code
2Q gate error
5×10⁻³
tunable-coupler CZ
T₁ coherence
≥ 200 μs
tantalum-on-silicon
Transduction η
≥ 0.1%
base acceptance · 1,550 nm
Stabilizer cycle
1 μs
MWPM decoder
Status
Target
G1 → G4 gates
Modules
4–8
scenario, contingent on G4
Physical qubits
2.5–5×10³
500-qubit module family
Logical qubits
10s
first multi-logical operation
2Q gate error
1×10⁻³
tunable-coupler CZ
T₁ coherence
≥ 500 μs
post-process improvements
Transduction η
≥ 0.5%
aggressive scenario
Stabilizer cycle
1 μs
MWPM at scale
Status
Scenario
contingent on QONTOS-1 G4
Modules
16–32
rack-scale scenario
Physical qubits
1–2.5×10⁴
rack-level mesh
Logical qubits
50–100
useful-work pilot
2Q gate error
5×10⁻⁴
below threshold for d ≤ 11
T₁ coherence
≥ 1 ms
surface treatment + screening
Transduction η
≥ 1%
research threshold
Stabilizer cycle
0.5 μs
improved decoder ASIC
Status
Scenario
conditional envelope
Modules
64–128
architecture study
Physical qubits
3.2–6.4×10⁴
500-qubit module basis
Logical qubits
500–1,000
research vision
2Q gate error
1×10⁻⁴
order below threshold
T₁ coherence
≥ 1 ms
platform target
Transduction η
TBD
purified backbone study
Stabilizer cycle
0.25 μs
custom decoder ASIC
Status
Research
not an engineering target
Modules
500–2,000+
facility-scale study
Physical qubits
2.5×10⁵–10⁶+
not 500 modules = 10⁶
Logical qubits
10³–10⁴+
resource-estimate study
2Q gate error
TBD
research assumption
T₁ coherence
TBD
research assumption
Interconnect
purified
fleet photonic backbone
Decoder
TBD
d ≥ 21 research fabric
Status
Research
architecture study
Programme status

Acceptance is gated. Calendars are not.

QONTOS-1 acceptance is the moment the architecture is proved. The QONTOS-2 programme begins at G4, not before; gates are acceptance criteria rather than calendar promises. Organisations on the specification register receive subsystem updates as gates retire.

Request the specification
PROGRAMME STATUS · MAY 2026
CURRENT GATE
Pre-G1
design + simulation
G1 GATE
Spec freeze
architecture freeze
G4 GATE
First logical
first logical qubit
RUNTIME
v2
operational today
Compute module · longitudinal section

Each subsystem retires one class of engineering risk.

COMPUTE MODULE · LONGITUDINAL CROSS-SECTION QONTOS-1 · MOD-A · DR-290 HOT COLD 295 K flange · IO μW DRIVE FLUX RO IN RO OUT OPTICAL 50 K attenuators 20 dB 10 dB 20 dB 4 K JTWPA JTWPA 10 dB 6 dB 10 dB 100 mK still transducer Electro-optic transducer LiNbO₃ ring C = 1 η ≥ 0.1 % → 1550 nm ≤ 20 mK mixing chamber SAMPLE HOLDER · 5-CHIPLET STACK CH01 ×100 CH02 ×100 CH03 ×100 CH04 ×100 CH05 ×100 5 chiplets · 500 transmons · CMP Ta on Si SINGLE MODULE · LONGITUDINAL · NOT TO SCALE 5 STAGES · η ≥ 0.1 % 500 TRANSMONS · HEAVY-HEX · TUNABLE COUPLERS

Cryostat envelope

Five-stage dilution refrigerator: 295 K / 50 K / 4 K / 100 mK still / ≤ 20 mK mixing chamber. The mixing chamber holds the qubit chip and the readout resonators. Cooling power target ≥ 25 μW at 20 mK; passive load below 1 μW from wiring.

Five-chiplet qubit assembly

Five tantalum-on-silicon transmon chiplets, 100 qubits each. Heavy-hex topology intra-chiplet, through-silicon superconducting routing chiplet-to-chiplet. Tunable-coupler CZ gates with 5×10⁻³ target error.

Electro-optic photonic transducer

Staged at the 100 mK still plate. Up-converts a microwave photon at 5 GHz to a telecom-band photon at 1,550 nm. Cooperativity C = 1 sets the impedance-matched conversion point; η ≥ 0.1 % is the QONTOS-1 base acceptance target and η ≥ 1 % remains a research threshold.

Heralding stage

50/50 beam splitter and SNSPDs sit on the 1.5 K stage outside the cryostat. A coincidence click is forwarded to the FPGA sequencer within five microseconds. Only heralded rounds count as Bell pairs.

Control rack + runtime host

Room-temperature rack: AWGs at 1 ns resolution, FPGA stabilizer sequencer, digitiser, MWPM decoder farm, and the QONTOS runtime host. Total feed-forward correction time ≤ 10 μs.

Device geometry · chip family

Two chip classes inside each module.

Each QONTOS-1 module integrates two device classes on the mixing-chamber plate. Five data chiplets carry one hundred tantalum-on-silicon transmons each in a heavy-hex tunable-coupler lattice. A paired characterisation chip carries five frequency-fixed transmons for per-qubit calibration, pulse-shape R&D, and decoherence characterisation under the same readout chain.

QONTOS · QC1-DT-100-Ta · DATA CHIPLET · REV 5.2 FAB · TaSi-04 · G2 LOT A1 A10 J1 J10 μW DRIVE PADS · D01 – D20FLUX BIAS PADS · F01 – F20RO IN · RI01 – RI06RO OUT · RO01 – RO06ACTIVE AREA · HEAVY-HEX · 100 TRANSMONS · d≤7 PATCHBUS 1BUS 2BUS 3BUS 4TSVTSV DEVICE SPEC ω_q/2π · 5.0 ± 0.2 GHz α/2π · −300 MHz T₁ ≥ 200 μs · T₂ ≥ 100 μs PROCESS · MATERIALS Tantalum on Si · CMP-polished JJ · Al/AlOₓ/Al shadow evap 0 1 mm 2 mm SCALE · DIE 5 × 5 mm² transmon syndrome anc. tunable coupler Purcell filter TSV port 100 TRANSMONS · HEAVY-HEX · 4 RO BUSES

Data chiplet

  • 10 × 10 tantalum-on-silicon transmon array, heavy-hex connectivity
  • Tunable coupler between every nearest-neighbour pair, fast CZ gates
  • Three readout lines per chiplet, frequency-multiplexed at 4 K
  • Five chiplets per module connected through superconducting through-silicon routing
CHIPLET REQUIREMENTS · PER UNIT
  • 100 microwave drive lines
  • 180 flux lines (90 qubit · 90 coupler)
  • 3 readout inputs
  • 3 readout outputs
  • 1 SQUID flux bias
QONTOS · QC1-CC-005-Ta · CHARACTERISATION CHIP · REV 5.2 FAB · TaSi-04 · G2 LOT A1 A5 E1 E5 DRIVE PADS · D1 – D5 · RO IN · RI1 – RI5FLUX PADS · F1 – F5 · RO OUT · RO1 – RO5GND · DIAGNOSTICGND · DIAGNOSTICACTIVE AREA · 5 ISOLATED TRANSMONS · NO QUBIT-QUBIT COUPLINGQ15.05 GHzQ25.12 GHzQ34.97 GHzQ45.21 GHzQ55.34 GHzRO bus DEVICE SPEC ω_q swept 4.9 – 5.4 GHz α/2π · −300 MHz T₁ ≥ 300 μs (target) PROCESS · MATERIALS Tantalum on Si · CMP-polished JJ · Al/AlOₓ/Al shadow evap 0 0.5 mm 1 mm SCALE · DIE 3 × 3 mm² capacitor pad Josephson junction readout resonator 5 TRANSMONS · ISOLATED · CHARACTERISATION

Characterisation chip

  • Five fixed-frequency transmons, isolated from one another
  • Longer coherence than the data chiplet (T₁ ≥ 300 μs target)
  • Used for pulse R&D, gate calibration protocols, decoherence characterisation
  • Shipped as a paired chip alongside the five data chiplets per module
CHIP REQUIREMENTS · PER UNIT
  • 5 microwave drive signals
  • 5 flux signals
  • 1 readout input
  • 1 readout output
  • no inter-qubit wiring
Deployment envelope

What the assembly delivers, what the facility provides, how circuits reach the device.

Assembly deliverables

The QONTOS-1 deliverable is a complete two-module assembly bound to the runtime, not a bare qubit device:

  • Two cryostat-mounted compute modules, five data chiplets each
  • One paired characterisation chip per module
  • Two room-temperature control racks (AWG · FPGA sequencer · digitiser)
  • Electro-optic transducer subsystem at the 100 mK still plate
  • Heralding stage at 1.5 K: beam splitter and SNSPD pair
  • Single-mode fibre interconnect at 1,550 nm, 0 to 5 m
  • QONTOS runtime v2 with the native executor bound at G2
  • Three-layer SHA-256 proof chain on every execution

Facility envelope

The assembly is qualified against a commercial dilution-refrigerator envelope meeting:

  • Mixing-chamber plate diameter ≥ 290 mm
  • Cooling power ≥ 25 μW at 20 mK; ≥ 500 μW at 100 mK
  • Wiring outfitted with stage-appropriate attenuation and filtering
  • Optical port at the 100 mK stage for the transducer fibre
  • Drive synthesis: 4 to 6 GHz qubit, 0 to 1 GHz flux
  • Readout chain: 7 to 8 GHz dispersive shift with JTWPA at 4 K
  • Floor footprint approximately 4 m × 6 m for two cryostats + racks

Execution pathway

The runtime accepts circuits today against simulator and external-provider backends. Native execution joins at G2.

  • Pre-G2. OpenQASM 3, Qiskit, and PennyLane circuits dispatched to qontos-sim and Aer simulators
  • Pre-G2. The same compiled plan routes to IBM Quantum and Amazon Braket through the ExecutorContract
  • At G2. Module A native execution joins as a fourth backend class
  • At G4. Two-module distributed circuit execution with the first logical qubit operational
Specification register

The machine is not on offer. The architecture specification is.

Organisations placed on the specification register receive the full QONTOS-1 engineering specification, dispatches as each acceptance gate retires, and supply-chain briefings ahead of public release. The register is closed; correspondence is not redistributed.

Research applications

Three research programmes opened by the first-machine assembly.

The first-machine assembly opens three categories of investigation for the quantum-engineering community: distributed fault-tolerant operation at the smallest physically meaningful module count, compiler and runtime research against a real distributed backend, and microwave-to-optical transduction physics at full system scale.

DISTRIBUTED CNOT · LATTICE SURGERY · d = 5 MODULE A · LOGICAL A MODULE B · LOGICAL B d=5 · 30 data · 12 anc d=5 · 30 data · 12 anc MERGED SEAM joint X⊗X stabilizer 5 / cycle d cycles data qubit X-syndrome Z-syndrome Bell pair cost · d² = 25 Bell pairs PROTOCOL · merge ▷ measure joint stabilizer ▷ split · 5 code cycles · effective logical CNOT SURFACE CODE · MODULAR BOUNDARY

Distributed fault-tolerant operation

The first-machine assembly executes a distance-d surface-code logical qubit across the module boundary. Lattice-surgery merges between the two patches are mediated by heralded Bell pairs delivered through the interconnect; the seam closes after d code cycles to realise an effective transversal CNOT.

Investigation surfaces

Distributed logical-memory experiments. Inter-module lattice-surgery characterisation. Distance-scaling studies preparing the QONTOS-2 logical envelope. Multi-patch error budget allocation.

RUNTIME PIPELINE · PLAN → EXECUTE → PROVE PLAN-TIME RUNTIME 01 · INGEST Circuit IR QASM 3 · Qiskit 02 · PARTITION Spectral O(n log n) 03 · SCHEDULE Backend bind 04 · EXEC Real-time FPGA + decode EXECUTOR CONTRACT · BACKENDS simulator IBM Quantum Amazon Braket qontos-sim QONTOS-1 05 · AGGREGATE → 06 · PROOF RESULT RECONSTRUCTION p(x) = ⊗ pi(xi) · S tensor product + shadow correlators over inter-partition Bell pairs L1 · INTEGRITY · H₁ = SHA-256(circuit ‖ manifest) L2 · PLAN · H₂ = SHA-256(H₁ ‖ plan) L3 · RESULT · H₃ = SHA-256(H₂ ‖ result) ONE PLAN · FIVE BACKENDS · ONE VERIFIABLE PROOF

Distributed compiler & runtime research

The QONTOS runtime is plan-time identical across every backend it addresses. The partitioner, scheduler, decoder pipeline, and proof chain that will drive native execution at G2 are the same artefacts that drive simulator and external-provider execution today.

Investigation surfaces

Partitioner optimisation against real distributed targets. Decoder benchmarking against measured syndrome distributions. Proof-chain audit tooling. Verifiable replay of historical runs across heterogeneous executors.

ELECTRO-OPTIC TRANSDUCTION · MODE COUPLING CLASSICAL PUMP ω_p = ω_o − ω_e · n_p ≈ 10⁴ photons LiNbO₃ · χ⁽²⁾ electro-optic resonator 100 mK still plate Microwave ωe/2π ≈ 5 GHz κe/2π = 1 MHz Optical ωo/2π ≈ 193 THz κo/2π = 10 MHz geo parametric coupling IN · μW OUT · 1550 nm IMPEDANCE-MATCHED COOPERATIVITY C = 4 geo2 / (κe · κo) = 1 END-TO-END EFFICIENCY · η BASE 0.1 % AGGRESSIVE 0.5 % RESEARCH ≥ 1 % → QONTOS-1 commit three coupled modes

Microwave-to-optical transduction physics

The first-machine assembly hosts the transducer subsystem at full system scale. QONTOS-1 accepts η ≥ 0.1 % as the base target, tracks η ≥ 0.5 % as an aggressive scenario, and treats η ≥ 1 % plus purification overhead as a research threshold for later architecture studies.

Investigation surfaces

Cooperativity scaling beyond C = 1. Pump-loss mitigation under cryogenic constraint. SNSPD bandwidth and dead-time. Phase-lock stability over the 5 m fibre run. Alternative transducer geometries benchmarked against the electro-optic baseline.

Subsystem supply chain

A first-machine assembly is a five-category supplier graph.

The QONTOS-1 assembly is a system-level integration of five subsystem categories: cryogenics, photonics, control electronics, software, and quantum error correction. Each category is qualified against the engineering envelope of the relevant subsystem. Final supplier selections are committed at G1, the architecture-freeze gate.

Cryogenics

Dilution refrigerators meeting the ≥ 290 mm mixing-chamber and ≥ 25 μW at 20 mK envelope.

Photonics

Microwave-to-optical transducer, SNSPD, fibre infrastructure, and 1.5 K staging.

Control electronics

AWG, digitiser, FPGA sequencer, and decoder farm hardware.

Software & compilers

Application frameworks, compilers, and execution platforms that target the QONTOS ExecutorContract.

Quantum error correction

Real-time decoder pipelines, ASICs, and surface-code research collaborators.

Engineering bulletin

Programme dispatches from the QONTOS engineering effort.

26.05.12

QONTOS Whitepaper v5.4 released for external technical review

The full QONTOS architecture whitepaper, including the QONTOS-1 specification, the photonic interconnect protocol, and the five-generation arc, is now available for external review.

Whitepaper
DOWNLOAD ↗
26.04.20

Software runtime v2 deployed against simulator and IBM Quantum backends

The QONTOS runtime, including the spectral partitioner, MWPM decoder, and three-layer SHA-256 proof chain, is operational against multiple external backends and ready for native-executor binding at G2.

Engineering update
VIEW PLATFORM →
26.02.04

Photonic transducer architecture down-selected for QONTOS-1

The QONTOS-1 photonic transducer is committed to the electro-optic LiNbO₃ resonator path with piezo-optomechanical kept on the R&D track for later research regimes.

Engineering update
VIEW INTERCONNECT →
Programme architecture

QONTOS is a five-generation engineering programme.

The QONTOS programme develops modular superconducting-photonic quantum computers across a five-generation arc. QONTOS-1 is the first-machine assembly that proves the architecture. QONTOS-2 and QONTOS-3 are conditional scenarios; QONTOS-4 and QONTOS-5 remain research-vision architecture studies.

Each generation is sized against the engineering risk retired by the one before it. The first commercially relevant logical-qubit count is the responsibility of QONTOS-2; full fault tolerance is the responsibility of the three generations that follow.

The QONTOS programme